From GPUs and HBM to CoWoS, chiplets, and data center power, here's how the pieces of the AI semiconductor story actually connect.
"GPUs are selling well" only tells half the story of the AI chip industry. Behind every compute chip sits memory fast enough to feed it data, packaging tight enough to bind chips together, and infrastructure sturdy enough to handle the heat and power draw β all of which has to work in sync before a service actually runs. This guide picks the terms that show up constantly in AI chip coverage but only make sense once you see how they connect.
Read it in order β compute (GPU, AI accelerators), memory (HBM), packaging (CoWoS, chiplets), infrastructure (power), then application (inference, networking) β and the full system comes into focus. This is a map of the industry, not a stock pick list; any investment decision should be made independently, based on your own review of official earnings releases and disclosures.
